Mechanic No Clean Bga Tin

Mechanic No Clean BGA Tin Solder Flux Paste is high bond strength and PH value-neutral. MCN-UV80 welding flux paste’s insulation is strong with welding surface smooth. This rosin soldering flux paste is the best for IC and PCB for no corrosive. This mechanic flux paste has a boiling point only slightly higher than the melting point of the solder. MECHANIC paste is for mobile phones, PC cards and other sophisticated electronic chip-level help welding.

Features Of MCNUV80 Rosin Flux Paste Soldering Grease for BGA PGA SMD Repairing Work:



100% brand new and high quality.

High synthetic BGA Solder Paste Tin Rosin-Based Flux Paste Cream.

PH value neutral, insulation is strong, welding surface smooth.

Professional Soldering Tin Flux for PC Cards Electronic Chip-level Welding.

Its boiling point only slightly higher than the melting point of the solder.

Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on.

Good soldering and welding tools.

IC and PCB for no corrosive

Super compacity: Applicable to PCB, BGA, SMD, PGA repair, Soldering, etc.

Rosin-based Solder Paste.



Specifications Of MECHANIC Highly Synthetic Halogen-Free BGA Electric Welding Flux:



Material: Plastic+ Rosin-based solder paste

Size: 80g

Type: Rosin-based BGA solder flux cream

Viscosity: 0.2Pas

Granularity: 0.22um

Application: for Phone BGA Board Soldering Fixing

Function: PC Cards Electronic Chip-level Welding



​Package Includes:



1 x Tin Soldering Flux Paste MCN-UV80



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