Small heat sink for TO-3. Diamond Basket 5750 is a series of diamond shaped basket board level heat sinks designed to cool TO‐3 devices. These black anodized heatsinks are perfect for cooling off components, IC or etc.
Specification:
Size: 41.40×32.7×25 (in mm)
Material: Aluminum
Surface: Black Anodized
Suitable for: TO-3 and RD-91 package components
Package Includes:
1 x Aluminum Heatsink TO-3 Package for Transistor
4 Inch Prob 500C K Type Thermocouple
₨ 660
| Weight | 1 kg |
|---|---|
| Dimensions | 2 × 2 × 2 cm |
| Quality | Orignal |
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